The Global Standard of Plasma Gas Scrubber

HPS-04M

Environmentally complete decomposition and treatment system of hazardous PFCs gases used in semiconductor & LCD manufacturing industry, by using DC Thermal Plasma.
Youngjin IND’s High-plasma Scrubber can decompose PFCs Gases(greenhouse gases)including flammable, Corrosive and toxic gases generated from the semiconductor & LCD manufacturing process equipment by using DC Thermal Plasma.
HPS-04M 이미지

  • Applicable Areas

    For dealing with cleaning gas in semiconductor & LCD manufacturing process

  • Apply Gas

    All process gas including PFCs gas

Product Specifications

Item HPS-04M
TYPE Plasma Wet
Dimension 800 x 850 x 1920
Capacity 400LPM
Weight 540 kg
Inlet NW40 X 4Port
Outlet MF100 X 1Port
Drain Power & Natural Drain
  • Features of Product

    High quality and ultimate safety

    High decomposition efficiency in treating PFCs gases

    Automatic anti-clogging pressure control in Scrubber (PLC Control) 

    Easy installation & cost-effective management/maintenance

    Preventing CO2 generation (No need of fuel gas)

  • Process & Gas Applied

    Process: All process for manufacturing semiconductors & LCDs

    Gas: All manufacturing process-related to gas treatment including PFCs

Features of Product Component

  • Thermal Plasma Decomposition
    - Perfect decomposition of toxic gases in high-temperature
    Spray Quenching/Absorption
    - Excellent removal of by-products through spray quenching
    Auto Power Drain
    - Drain wastewater smoothly
    Gas Vent
    - Minimized Exhaust of powder, water & moisture
  • Pressure Control
    - Measure the accurate pressure and powder clogging through PID-type pressure
    Auto Control System
    - PLC-based touch screen display
    - Auto/Manual modes & easy control
    - Demonstrating errors & recording history error log
    - Fast-responding & highly accurate PLC Control
    By-Pass Function
    - Automatic gas-flow control by 3-way pneumatic valves

Product Specification

Model Name Dimension [W x D x H] Capacity(Ipm) Inlet Q’ty[EA] Applicable Process Remarks
HPS™-04M 800 x 850 x 1920 400 4 CVD, T/F, Etch For wafer process

Utility Specification

Cabinet Dimension(mm) WIDTH DEPTH HEIGHT
800 850 1920
POWER Voltage AC 208V
PHASE 3Phase
Current 75A, 50 ~ 60Hz, 4lines
Max. Capacity 400LPM
UTILITY SIZE TYPE FLOW(LPM) PRESSURE(PSI)
GAS 1 GN2 3/8” SUS 15 ~ 30 50 ~ 85
2 CDA 3/8” SUS 0(V/V Driving) 50 ~ 85
WATER 3 PCW IN 1/2” SUS 7 ~ 10 50 ~ 71
4 PCW OUT 1/2” SUS 7 ~ 10 50 ~ 71
5 NPW 1/2” SUS 4 ~ 20 35 ~ 71
EXHAUST 6 CABINET MF100 SUS 600
USER GAS 7 INLET NW40 SUS 150
8 OUTLET MF100 SUS 600
9 BY-PASS NW40 SUS 150
DRAIN 10 POWER 1” CPVC Use Forced Drain
11 NATURE 1 1/2” CPVC Use Natural Drain

TAGET ABATEMENT GAS

PFC gases : NF3, SF6, CF4, C2F6, C3F8, etc.

Flammable gases : SIH4, TEOS, H2, PH3, etc.

Water Soluble gases : BCL3, Clw, HF, HCl, NH3, etc.